Job Title : IC Packaging Design Engineer
\nJob Location : Chandler, AZ/ Hillsboro, OR (Onsite)
\nDuration : 12+ Months
\n \nJob Description:
\nAs an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.
\nWhat You'll Do
\nWhat You Bring
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